mos fet relays technical information 1 mos fet relays technical information introduction new models with a wider range of characteristics provide an array of solutions, meeting the needs of today?s high performance applications . our expanded range of mos fet relays, type g3vm, sets the benchmark in solid state relays ( ssrs). products are manufactured using the latest advances in automated production and include a variety of improved construction tec hnologies within the areas of the input led, pda (photo diode array used as a photocoupler) and mos fet chips used in the load switch ing circuit. as a result, further reductions in package size and power requirements have been achieved. combining the advantages of mechanical and solid state technology, the new g3vm range gives you unprecedented capabili ty to design. all models featured include a double mos fet load circuit, enabling the designer complete versatility since it makes no difference whether an ac or dc load in eit her direction is connected (connec- tion a). thus, the mos fet relay is a fully functional alternative to an electromechanical relay with mini mal additional drive circuitry. the built-in current limit functi on (clr models) has many uses. traditionally used to clamp excessive over current fault conditions in telecom equipment, this feature can also be used to good effect to resist transient and sh ort circuit conditions. mos fet relays are the ideal data and telecommunication solution for line seizing, line switching, hook switching, data access arrange- ment (daa) function, line transformer circuit control and other feature phone functions. central office app lications requir e high reliability and long life. here the g3vm is ideal for use in the areas of sub- scriber line interfaces (slics) multiplexers and routers. in addition, local area networks (lans) and network termination units (ntus) including set-top boxes (stbs) and remote metering systems (rms) can take advantage of the g3vms? small size and low on resistance. advances in performance and cost reduction enable mos fet relays to be considered as good alter natives to reed relays in appli- cation areas such as security mo tion detectors (standard and anti- mask pirs), and automated test equipment (ate) probe cards. glossary term symbol description led forward current i f rated current that can flow continuously in the forward direction of the led repetitive peak led forward current i fp rated current that can flow momentaril y in the forward direction of the led led forward current reduction rate 2 mos fet relays technical information precautions !warning be sure to turn off the power when wiring the relay, otherwise an electric shock may be received. !warning r !caution io r r !caution r r r !caution a t typical relay driving circuit examples use the following formula to obtai n the led current limiting resis- tance value to assure that the relay operates accurately. use the following formula to obtain the led forward voltage value to assure that the relay releases accurately. protection from surge voltage on the input terminals if any reversed surge voltage is imposed on the input terminals, insert a diode in parallel to the input terminals as shown in the follow- ing circuit diagram and do not impose a reversed voltage value of 3 v or more. surge voltage protection circuit example appearance examples sop (small outline package) dip (dual inline package) omron logo model name lot no. omron logo model name lot no. ssop (shrink small outline package) omron mark model name lot no. 211 228 note: "g3vm" is not printed on the actual product. load c-mos transistor 10 to 100 k load r 1 = v cc ? v ol ? v f (on) 5 to 20 ma v f (off) = v cc ? v oh < 0.8 v
mos fet relays technical information 3 protection from spike voltage on the output terminals if a spike voltage exceeding the absolute maximum rated value is generated between the output terminals, insert a c-r snubber or clamping diode in parallel to the load as shown in the following circuit diagram to limit the spike voltage. spike voltage protection circuit example unused terminals (6-pin models only) terminal 3 is connected to the in ternal circuit. do not connect any- thing to terminal 3 externally. pin strength for automatic mounting in order to maintain the characteristics of the relay, the force imposed on any pin of the relay for automatic mounting must not exceed the following. in direction a: 1.96 n in direction b: 1.96 n load connection do not short-circuit the input and output terminals while the relay is operating or the relay may malfunction. guidelines for mounting devices on pcbs cleaning when ions in the flux enter into the product during soldering, fluctua- tion in device performance or corrosion may occur. be sure to wash away any flux residue which c ontains cl or na ions. the following types of solvents are recommended for cleaning the flux: ? asahi clean ak-225aes ? kao cleanthru 750h ? pine-alpha st-100s cleaning conditions cleaning conditions and pr ecautions may vary according to product specifications. general precautions for dip cleaning dipping time varies according to the solvent used. however, as a general guideline, it is recommended that the dip time be limited to three minutes. general precautions for ultrasonic cleaning when ultrasonic cleaning is c onducted for an excessively long time, contact between the product resin and the metal leads may lessen. also, excessive ultrasonic stress may cause cracks in the pellet. it is recommended that the applied stress be minimized. recommended conditions for standard ultrasonic cleaning frequency: 27khz to 29khz output: 0.25 w/cm 2 or less time: 30 seconds or less temperature: 50 c (may vary according to the type of solvent used) cleaning must be conducted with the printed circuit board or device floating on the solvent, so as to avoid direct contact between the pcb or device and the ultrasonic vibrator. handling precautions do not touch the device?s mark-bearing surface with your hand or with a brush while cleaning or appl ying cleaning liquid to the device. this may erase device markings. it is important to confirm that nei- ther the solvent used for cleaning nor the cleaning conditions will damage the device package. + ? 1 2 3 6 5 4 ac + ? + ? dc d c or: or: load load load + ? 1 2 3 6 5 4 + ? dc + ? 1 2 3 6 5 4 + ? dc + ? 1 2 3 6 5 4 + ? dc load ac connection dc sin g le connection dc parallel connection
4 mos fet relays technical information solder mounting perform solder mounting under the following recommended conditions to prevent the temperature of the relays from rising, causing possible damage to the relays. flow soldering through hole pac kages (once only) note: it is recommended that the suit ability of solder mounting be verified under actual conditions reflow soldering surface mount packages (twice max.) *measured from the top surface of the relay package note: 1. it is recommended that the suitability of solder mounting be verified under actual conditions 2. tape cut ssop?s are packaged wi thout humidity resistance. use manual soldering to mount them. manual soldering (once only) manually solder at 350 c for 3s or less or at 260 c for 10s or less. ssop handling precautions humidity-resistant packaging component cases can crack if surface-mounted components that have absorbed moisture are subj ected to thermal stress when mounting. to prevent this, observe the following precautions. 1. unopened components can be stored in the packaging at 5 to 30 c and a humidity of 90% max. however, they should be used within 12 months. 2. after the packaging has been opened, components can be stored at 5 to 30 c and a humidity of 70% max. however, they should be mounted within 168 hours. 3. if, after opening the packaging, the humidity indicator turns pink to the 30% mark or the expiration date is exceeded, then bake the components while they are still on the taping reel and use them within 72 hours. do not bake the same compo- nents more than once. baking conditions: 60 5 c, 64 to 72 hours 4. if the same components are baked repeatedly, then the tape detachment strength will change , causing potential problems when mounting. use caution when mounting under these conditions. 5. when mounting using dehumidifying measures, always take countermeasures against component damage from static electricity. 6. do not throw or drop the components. if the laminated pack- aging material is damaged, airtightness will be lost. 7. tape cut ssop?s are packaged without humidity resistance. use manual soldering to mount them. solder type preheating temperature solder temperature lead solder (snpb) 150 c, 60 to 120s 260 c, 10s max. lead-free solder (snagcu) 150 c, 60 to 120s 260 c, 10s max. solder type preheating temperature* soldering temperature* lead solder (snpb) 140 to 160 c, 60 to 120s 210 c, 30s max. peak, 240 c max. lead-free solder (snagcu) 180 to 190 c, 60 to 120s 230 c, 30 to 50s peak, 260 c max.
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mos fet relays technical information omron on-line global - http://www.omron.com usa - http://www.components.omron.com cat. no. x302-e-1 printed in usa omron electronic components llc 55 e. commerce drive, suite b schaumburg, il 60173 847-882-2288 12/10 specificat ions subject to change without notice all sales are subject to omron electronic components llc standard terms and conditions of sale, which can be found at http://www.components.omron.com/compon ents/web/webfiles.ns f/sales_terms.html all dimensions shown are in millimeters. to convert millimeters into inches, multiply by 0.0393 7. to convert grams into ounces, multiply by 0.03527.
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